Copper Sputtering Targets

1.Purity:99.9 - 99.999% 2.Element:Copper and Copper alloy 3.Target Shape:plate,wafer,rectangular,square,circle,tube,etc. Sputtering is a PVD method for manufacturing thin films by means of evaporating solid target material (the so called sputtering target) by means of an erosive plasma and depositing the evaporated target material onto the surface of the substrate forming a thin film layer. Name: Copper sputtering target, Copper target, Copper alloy sputtering argetPurity: 99.9 - 99.999% Element: Copper and Copper alloyTarget Shape: plate, wafer, rectangular, square, circle, tube, step wafer, step rectangle, and customer tailored.

Copper Sputtering Targets,Copper target
Material		Purities	Application
Cu	Copper	4N5, 5N	Electronics & Semiconductor
Cu	Copper	4N, 4N7	Displays
Cu	Copper	*	Glass Coating
CuAl	Copper Aluminium	*	Glass Coating
CuCr	Copper Chromium	3N5	Electronics & Semiconductor
CuGa	Copper Gallium	4N	Photovoltaics
CuIn	Copper Indium	4N	Photovoltaics
CuNi	Copper Nickel	3N5	Electronics & Semiconductor
CIG	Copper Indium Gallium	4N	Photovoltaics
other Cu	Copper / Copper alloys	*	others

           

Copper Sputtering Targets